The solution lies in utilizing advanced insulating materials specifically designed for miniaturization. High-performance polymers (HPPs) such as polyamide (PPA), liquid crystal polymers (LCPs), and other specialized polymers offer high strength and superior dimensional stability while maintaining lightweight characteristics. These properties make HPPs an ideal choice for applications requiring miniaturized connectors, such as V2X, 5G, networking, and IoT.
Connector miniaturization: Identifying advanced materials
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